NXP Semiconductors
BAT754L
Schottky barrier triple diode
BAT754L
All information provided in this document is subject to legal disclaimers.
? NXP B.V. 2012. All rights reserved
Product data sheet
22 November 2012
6
/
9
sot363_fw
solder
lands
solder
resist
occupied
area
preferred
transport
direction
during
soldering
5.3
1.3
1.3
1.5
0.3
1.5
4.5
2.45
2.5
Dimensions
in
mm
Fig. 6.
Wave soldering footprint for TSSOP6 (SOT363)
11.
Revision history
Table 8.
Revision history
Data sheet ID
Release date
Data sheet status
Change notice
Supersedes
BAT754L v.2
20121122
Product data sheet
-
BAT754L v.1
Modifications:
?
The format of this document has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
?
Legal texts have been adapted to the new company name where appropriate.
?
Section 1 Product profile: updated
?
Section 4 Marking: updated
?
Table 5 Limiting values: changed Tamb
minimum value to -55 °C according to AEC-Q101
?
Figure 1 and 2: updated
?
Section 8 Test information: added
?
Figure 4: superseded by minimized package outline drawing
?
Section 10 Soldering: added
?
Section 11 Legal information: updated
BAT754L v.1
20010118
Product specification
-
-
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